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Electroplating processing
Plating materials: all kinds of conventional and special materials such as gold, silver, copper, tin, brass, etc., such as the electroplating of simple metal, alloy or multi-layer composite metal materials, with the thickness of 0.1-5um.
Material range: Minimum wire diameter 0.02mm. Metal electroplating can improve various properties of basic wire materials, such as oxidation resistance, electrical conductivity, weldability, etc.
**Application scope: Semiconductor, circuit board, electrode, medical device, etc.
Specific processing requirements can be negotiated with Peiertech.
Electroplating processing
Plating materials: all kinds of conventional and special materials such as gold, silver, copper, tin, brass, etc., such as the electroplating of simple metal, alloy or multi-layer composite metal materials, with the thickness of 0.1-5um.
Material range: Minimum wire diameter 0.02mm. Metal electroplating can improve various properties of basic wire materials, such as oxidation resistance, electrical conductivity, weldability, etc.
**Application scope: Semiconductor, circuit board, electrode, medical device, etc.
Specific processing requirements can be negotiated with Peiertech.
